Green silicon carbide is a dominant abrasive for wafer lapping. It combines high processing efficiency, low surface damage, stable performance and outstanding cost performance, widely applied in lapping and semi-fine polishing of photovoltaic and semiconductor silicon wafers.

Green silicon carbide micropowder has high temperature resistance, low thermal expansion coefficient, good thermal shock resistance and stable chemical performance.widely used as functional filler in thermal insulation & refractory materials, which can effectively improve high-temperature structural stability, enhance compression resistance and anti-oxidation ability, and prolong service life of insulation layers.

Black silicon carbide (Black SiC Powder) is a high-purity ultra-fine functional filler specially developed for water-based & solvent-based industrial paints, coatings and anticorrosive coatings.

Green silicon carbide lapping powder is high-purity alpha silicon carbide fine powder, featured with bright green color, ultra-high hardness, excellent self-sharpening property, chemical stability and tightly controlled particle size. It is widely used for precision lapping, fine grinding and mirror polishing of hard & brittle materials, especially for electronics, semiconductor and electronic ceramic industries.

Black silicon carbide (Black SiC) is a high-performance artificial crystalline material smelted at ultra-high temperatures from quartz sand and petroleum coke. It features high hardness, high melting point, low thermal expansion, high thermal conductivity, outstanding thermal shock resistance, excellent wear resistance and strong acid & alkali corrosion resistance.

Green SiC features high hardness, excellent self-sharpening, narrow particle size distribution, low subsurface damage and low contamination, perfectly matching FA fiber end-face planarization requirements,it is the core abrasive material for FA polishing slurry, polishing liquid and precision optical grinding media.