Green silicon carbide (SiC) micro powder plays a critical role in the semiconductor industry, particularly in wafer processing, power electronics, and advanced packaging, due to its exceptional hardness, thermal conductivity, and chemical stability. Below are its key applications and technological advantages: 1. Primary Applications in Semiconductor Manufacturing (1) Wafer Lapping & Polishing Silicon (Si) & Silicon Carbide

Black silicon carbide is an excellent, economical choice for cutting quartz in applications where extreme precision is not critical

Black silicon carbide (SiC) is commonly used in foam ceramics due to its excellent properties, such as high thermal conductivity, thermal shock resistance, mechanical strength, and chemical stability

Silicon carbide (SiC) is a high-performance refractory material due to its exceptional thermal, mechanical, and chemical properties. Here’s a detailed breakdown of its applications, advantages, and limitations in refractory contexts: 1. Key Properties Making SiC Ideal for Refractories Property SiC Value Refractory Benefit Melting Point ~2,700°C (4,892°F) Withstands ultra-high temperatures (e.g., steelmaking, kilns). Thermal Conductivity 120-270 W/m·K

          Green silicon carbide (SiC) is a high-purity abrasive material widely used in semiconductor substrate polishing due to its exceptional hardness (9.2–9.5 Mohs), thermal stability, and chemical inertness. Here’s a detailed breakdown of its role in semiconductor substrate polishing: 1. Key Properties of Green SiC for Polishing High Hardness: Effective for

Green silicon carbide is ideal for wafer polishing where a combination of hardness, purity, and controlled material removal is required. It bridges the gap between cost-effective alumina and ultra-expensive diamond abrasives, making it a preferred choice for semiconductor and optical industries.