Green silicon carbide powder features high hardness, uniform particle size and great chemical stability. It provides high polishing efficiency, ultra-smooth wafer surface and low subsurface damage, being an ideal abrasive for silicon wafer polishing.

Green silicon carbide is a dominant abrasive for wafer lapping. It combines high processing efficiency, low surface damage, stable performance and outstanding cost performance, widely applied in lapping and semi-fine polishing of photovoltaic and semiconductor silicon wafers.

Green silicon carbide micropowder has high temperature resistance, low thermal expansion coefficient, good thermal shock resistance and stable chemical performance.widely used as functional filler in thermal insulation & refractory materials, which can effectively improve high-temperature structural stability, enhance compression resistance and anti-oxidation ability, and prolong service life of insulation layers.

Green silicon carbide lapping powder is high-purity alpha silicon carbide fine powder, featured with bright green color, ultra-high hardness, excellent self-sharpening property, chemical stability and tightly controlled particle size. It is widely used for precision lapping, fine grinding and mirror polishing of hard & brittle materials, especially for electronics, semiconductor and electronic ceramic industries.

Green silicon carbide has higher silicon carbide purity, lower impurity content, lighter color (emerald green crystal), finer texture and better finish after processing. It is mainly applied in high-precision, low-pollution, electronic and semiconductor industries.

Black silicon carbide is one of the most widely used high-performance refractory materials for furnace linings, especially in high-temperature, corrosive, and thermal-shock environments