Green silicon carbide (GC) micropowder is high-purity silicon carbide fine powder, widely used in semiconductor wafer processing.
- Higher purity & lower heavy metal impurities Green SiC contains fewer iron and other metal contaminants. Metal pollution will cause electrical defects on wafers, so low impurity is critical for semiconductor chips.
- Sharp, uniform crystal edges Its crystal structure produces sharp cutting edges with stable hardness. It is excellent for multi-wire slicing, lapping and backside thinning of silicon wafers, SiC wafers and compound semiconductor substrates.
- Controllable narrow particle size distribution Green SiC micropowder can be classified into precise submicron and fine micron grades. It creates less subsurface damage on wafer surfaces compared with many other abrasives.
- Good chemical stability It is resistant to acid and corrosion, suitable for preparing water-based grinding slurry and polishing suspension. It does not easily react with wafer materials during processing.
- Consistent grinding performance Green SiC has stable hardness and thermal conductivity. It brings uniform cutting force, fewer cracks and better surface finish for precision semiconductor manufacturing
Green silicon carbide size distribution(JIS STANDARD):
| Size | D0（um） | D3(um) | D50(um) | D94(um) |
| #240 | ＜127 | ＜103 | 57.0±3.0 | ＞40 |
| #280 | ＜112 | ＜87 | 48.0±3.0 | ＞33 |
| #320 | ＜98 | ＜74 | 40.0±2.5 | ＞27 |
| #360 | ＜86 | ＜66 | 35.0±2.0 | ＞23 |
| #400 | ＜75 | ＜58 | 30.0±2.0 | ＞20 |
| #500 | ＜63 | ＜50 | 25.0±2.0 | ＞16 |
| #600 | ＜ 53 | ＜41 | 20.0±1.5 | ＞13 |
| #700 | ＜45 | ＜37 | 17.0±1.5 | ＞11 |
| #800 | ＜38 | ＜31 | 14.0±1.0 | ＞9.0 |
| #1000 | ＜32 | ＜27 | 11.5.±1.0 | ＞7.0 |
| #1200 | ＜27 | ＜23 | 9.5±0.8 | ＞ 5.5 |
| #1500 | ＜23 | ＜20 | 8.0±0.6 | ＞4.5 |
| #2000 | ＜19 | ＜17 | 6.7±0.6 | ＞4.0 |
| #2500 | ＜16 | ＜14 | 5.5±0.5 | ＞3.0 |
| #3000 | ＜13 | ＜11 | 4.0±0.5 | ＞2.0 |
| #4000 | ＜11 | ＜8.0 | 3.0±0.4 | ＞1.8 |
| #6000 | ＜8.0 | ＜5.0 | 2.0±0.4 | ＞0.8 |
| #8000 | ＜6.0 | ＜3.5 | 1.2±0.3 | ＞0.6 |
Main applications：
Green silicon carbide micropowder is mainly used as precision abrasive slurry for wafer processing:
- Multi-wire sawing / slicing Cut monocrystalline silicon wafer, SiC wafer, GaAs, sapphire and other compound semiconductor substrates. Remove material efficiently, control kerf loss and reduce wafer cracks.
- Wafer lapping & backside thinning After slicing, lap and thin wafer backside to get flat, uniform thickness, lower subsurface damage. This is the biggest application for semiconductor GC micropowder.
- Fine pre-polishing (pre-CMP) Fine grinding before CMP, remove lapping marks, improve surface roughness, reduce polishing time of expensive CMP slurry.
- Wafer edge grinding / edge profiling Chamfer and grind wafer edge to prevent edge chipping in follow-up processes.