Green Silicon Carbide, abbreviated as GC, is a high-purity artificial abrasive material fused and crystallized from high-grade silica sand and petroleum coke in high-temperature resistance furnaces. It features extremely high hardness, sharp particle edges, excellent self-sharpening performance, stable chemical inertness, low metallic impurities, superior thermal conductivity and insulation properties. Compared with black silicon carbide, green silicon carbide has higher purity, fewer harmful impurities, finer crystal structure and stronger corrosion resistance, making it the preferred premium abrasive for precision processing, electronics, semiconductors and high-end industrial fields.
1. Physical & Chemical Properties
- Chemical composition: Main content SiC ≥ 99.0%, ultra-low iron, aluminum, calcium and other heavy metal impurities, free carbon and oxide content are strictly controlled
- Mohs hardness: 9.2–9.5, second only to diamond and boron carbide
- Crystal feature: Sharp angular grain shape, strong cutting force and outstanding self-sharpening
- Density: 3.12~3.20 g/cm³
- Thermal stability: Melting point up to 2250℃, high temperature resistance, no deformation or softening
- Chemical resistance: Acid and alkali resistant, non-corrosive, non-reactive with most metal and non-metal materials
- Electrical performance: Good insulation and high thermal conductivity, no conductive pollution
| TYPICAL CHEMICAL ANALYSIS | |
| SiC | ≥99.05% |
| SiO2 | ≤0.20% |
| F,Si | ≤0.03% |
| Fe2O3 | ≤0.10% |
| F.C | ≤0.04% |
| TYPICAL PHISICAL PROPERTIES | |
| Hardness: | Mohs：9.5 |
| Melting Point: | Sublimes at 2600 ℃ |
| Maximum service temperature: | 1900℃ |
| Specific Gravity: | 3.20-3.25g/cm3 |
| Bulk density(LPD): | 1.2-1.6 g/cm3 |
| Color: | Green |
| Particle shape: | Hexagonal |
| Available Size： | |
| Grit：4# 5# 6# 8# 10# 12# 14# 16# 20# 22# 24# 30# 36# 40# 46# 54# 60# 70# 80# 10# 12# 14# 16# 20# 22# 24# 30# 36# 40# 46# 54# 60# 70# 80# 90# 100# 120# 150# 180# 220# Micropowder： JIS:240# 280# 320# 360# 400# 500# 600# 700# 800# 1000# 1200# 1500# 2000# 2500# 3000# 4000# 6000# 8000# 10000# FEPA： F230 F240 F320 F360 F400 F500 F600 F800 F1000 F1200 F1500 F2000 | |
2. Main Advantages
- Ultra-high purity with low impurity content, no ion contamination, avoiding short circuit, electric leakage and performance attenuation of electronic components.
- Sharp and uniform grain size distribution, low scratch rate, suitable for ultra-precision grinding and mirror polishing.
- Brittle and dense crystal, easy to break to form new cutting edges, long service life and high processing efficiency.
- Anti-oxidation, anti-corrosion and wear-resistant, adaptable to wet grinding, dry grinding and various liquid polishing environments.
- High thermal conductivity and insulation, widely used as functional filling powder for heat dissipation and insulation in electronic industry.
3. Wide Industrial Applications
① Electronic & Semiconductor Industry
Specialized for precision processing of electronic components: silicon wafer slicing, grinding and thinning, SiC/GaN semiconductor substrate lapping, quartz crystal wafer polishing, ceramic electronic components (MLCC, varistor, ceramic substrate) fine grinding and deburring. It is the standard abrasive for high-precision electronic precision parts due to low pollution.
② Precision Polishing & Abrasive Tools
Used for surface fine grinding and mirror polishing of hard and brittle materials: optical glass, gemstone, jade, precision hardware, alloy tools, and making high-grade grinding wheels, oil stones, abrasive belts and polishing paste.
③ Advanced Functional Filler
Green silicon carbide micropowder is widely added into thermal conductive glue, insulating coating, sealing materials and high-temperature resistant coatings to improve heat dissipation, insulation, wear resistance and high-temperature stability of electronic equipment.
④ Other High-end Fields
Used for refractory materials, aerospace accessories surface treatment, corrosion-resistant engineering materials and precision mold finishing.