Green silicon carbide is ideal for wafer polishing where a combination of hardness, purity, and controlled material removal is required. It bridges the gap between cost-effective alumina and ultra-expensive diamond abrasives, making it a preferred choice for semiconductor and optical industries.

Green silicon carbide (SiC) powder is a high-purity, synthetic abrasive material widely used in precision polishing applications, including optical fiber polishing. Its exceptional hardness (9.5 on the Mohs scale), sharp particle morphology, and chemical stability make it suitable for achieving ultra-smooth surfaces with minimal subsurface damage. Key Properties for Optical Fiber Polishing: High Purity (≥99%) – Minimizes

Black silicon carbide is an outstanding refractory material for applications requiring high thermal conductivity, shock resistance, and durability in harsh environments.

The corrosion resistance of green silicon carbide (SiC) and black silicon carbide (SiC) differs slightly due to variations in purity and microstructure, though both are generally highly resistant to chemical attack.

Black silicon carbide (SiC) is a hard, abrasive material commonly used for polishing and grinding applications, including the polishing of copper. Here’s how it can be used effectively for copper polishing: Properties of Black Silicon Carbide for Copper Polishing Hardness (9.5 Mohs): Effective for removing oxidation, scratches, and imperfections. Sharp & Angular Grains: Provides aggressive

Black Silicon Carbide: Properties and Applications 1. Overview Black silicon carbide (SiC) is a synthetic ceramic material produced by heating a mixture of silica sand and petroleum coke in an electric resistance furnace at high temperatures (around 2200°C). It is harder than aluminum oxide but less tough than diamond or boron carbide. 2. Key Properties