green silicon carbide micropowder is the workhorse abrasive for polishing hard ceramics and glass, offering an outstanding balance of cutting performance, purity, and cost between softer oxides and ultra-expensive diamond.

black silicon carbide is a premium refractory material chosen for specific, high-stress applications where its outstanding thermal shock resistance, high thermal conductivity, and wear resistance are critical to improving furnace efficiency, longevity, and performance.

SiC remains vital for semiconductor wafer cutting, especially in traditional slurry-based sawing. However, diamond wire cutting is gaining dominance for SiC and advanced materials. For optimal performance, select high-purity green SiC with controlled particle size and shape.

Black silicon carbide (SiC) powder is widely used as a refractory material due to its exceptional thermal, mechanical, and chemical properties. Here’s how it functions in refractory applications

Green silicon carbide (SiC) powder can be used in non-stick coatings to enhance durability, abrasion resistance, and thermal conductivity

For wafer polishing, green silicon carbide is not recommended except for initial rough grinding of ultra-hard substrates (e.g., SiC or sapphire wafers)