Green Silicon Carbide (GC) Polishing Powder is a high-purity, fine-grit abrasive used for precision finishing of hard and brittle materials. Its properties make it indispensable in various high-tech industries.
Key Characteristics of Green Silicon Carbide Polishing Powder
Extreme Hardness: With a Mohs hardness of 9.2-9.3, it is significantly harder than most materials it is used on, allowing for effective cutting and polishing.
Sharp and Friable Grains: The grains are angular and brittle. During use, they fracture to reveal new, sharp edges. This self-sharpening property ensures consistent cutting efficiency and prevents dulling.
High Thermal Conductivity: It efficiently dissipates heat generated during polishing, reducing the risk of thermal damage to the workpiece.
Chemical Inertness: It does not react with acids or bases, ensuring a clean polishing process without contamination.
Fine and Uniform Particle Size: It is processed and classified into very fine micron-sized powders (e.g., W40 to W0.5 or finer) with a narrow particle size distribution, which is crucial for achieving a scratch-free, mirror-like finish.
| TYPICAL CHEMICAL ANALYSIS | |
| SiC | ≥99.05% |
| SiO2 | ≤0.20% |
| F,Si | ≤0.03% |
| Fe2O3 | ≤0.10% |
| F.C | ≤0.04% |
| TYPICAL PHISICAL PROPERTIES | |
| Hardness: | Mohs：9.5 |
| Melting Point: | Sublimes at 2600 ℃ |
| Maximum service temperature: | 1900℃ |
| Specific Gravity: | 3.20-3.25g/cm3 |
| Bulk density(LPD): | 1.2-1.6 g/cm3 |
| Color: | Green |
| Particle shape: | Hexagonal |
| SIZE： | |
| Grit：4# 5# 6# 8# 10# 12# 14# 16# 20# 22# 24# 30# 36# 40# 46# 54# 60# 70# 80# 10# 12# 14# 16# 20# 22# 24# 30# 36# 40# 46# 54# 60# 70# 80# 90# 100# 120# 150# 180# 220# Micropowder： JIS:240# 280# 320# 360# 400# 500# 600# 700# 800# 1000# 1200# 1500# 2000# 2500# 3000# 4000# 6000# 8000# 10000# FEPA： F230 F240 F320 F360 F400 F500 F600 F800 F1000 F1200 F1500 F2000 | |
Primary Applications
Green silicon carbide polishing powder is typically used as a free abrasive, suspended in a liquid (water or oil) to form a slurry or mixed into a paste. Its main applications are:
1. Precision Polishing of Advanced Ceramics
This is one of its most common uses. It is ideal for polishing:
Silicon Carbide (SiC) Seals and Components: It is the abrasive of choice for finishing reaction-bonded and sintered silicon carbide mechanical seals, bearings, and other critical parts.
Alumina (Al₂O₃) Ceramics: Used for substrates, insulators, and wear-resistant parts.
Zirconia (ZrO₂) Ceramics: For biomedical implants, bearings, and cutting tools.
2. Optical Manufacturing
Lens and Prism Polishing: For finishing glass lenses, prisms, and other optical components to achieve high clarity and precise surface figures.
Crystal Polishing: Used for polishing crystals like sapphire (used for watch glasses, smartphone camera lenses, and LED substrates) and quartz.
3. Semiconductor and Photovoltaic Industry
Wafer Slicing and Thinning: While diamond is more common for primary slicing, GC powder is used in certain lapping and thinning processes for silicon wafers and other semiconductor materials.
Wafer Lapping: It is used to remove subsurface damage from slicing and to achieve a highly flat and parallel surface before the final polishing step (which often uses colloidal silica).
4. Metal Finishing
Hard Alloy Polishing: For finishing hard metals like tungsten carbide tools and dies.
Pre-Deployment Polishing: It provides the initial fine finish on stainless steel or other metals before a final buffing with a softer abrasive.
5. Stone and Lapidary Work
Gemstone Polishing: Used in the final polishing stages for hard gemstones like agate, jasper, and synthetic stones.
Precision Stone Components: For finishing high-end stone tiles or architectural elements requiring a perfect finish.