Product Description
Black silicon carbide powder is a high-purity advanced ceramic material synthesized via Acheson process, featuring exceptional hardness, thermal stability, electrical conductivity, and chemical inertness. It is widely used as a functional filler, abrasive, and reinforcement in high-value industries.
Key Properties
- Hardness: Mohs 9.2–9.3
- Thermal Stability: Stable at 1200°C (air), 1700°C (inert atmosphere); Melting point ≈2700°C
- Thermal Conductivity: ≈120 W/(m·K)
- Thermal Expansion Coefficient: ≈4×10⁻⁶/°C
- Electrical Conductivity: Semiconductive (superior to traditional ceramics)
- Chemical Inertness: Resistant to acids, alkalis, and electrolytes
Key Advantages
- Multifunctional: Combines wear resistance, thermal stability, conductivity, and reinforcement.
- Wide Temperature Adaptability: -200°C to 1700°C (inert atmosphere).
- High Cost-Effectiveness: Superior performance vs. traditional materials (e.g., alumina, carbon black).
1. In Lithium-Ion Batteries
- Silicon-carbon anode additive: Improves conductivity, buffers volume expansion, stabilizes cycle life.
- Conductive & thermal-stable filler: Enhances safety and high-temperature performance.
- Ceramic-coated separator component: Increases heat resistance and puncture strength.
2. In Aerogel Thermal Insulation Sheets (for battery PACK)
- High-temperature infrared opacifier: Blocks radiant heat during thermal runaway.
- Reinforcement: Makes aerogel stronger, less brittle, resistant to vibration and powder fall-off.
- Heat stabilizer: Works stably at 600–1200°C.
3. Abrasives & Grinding
- Bonded abrasives (grinding wheels)
- Coated abrasives (sandpaper, sanding belts)
- Lapping & polishing for metals, semiconductors, glass
4. Refractory & Ceramic Materials
- High-temperature kiln furniture
- Wear-resistant and corrosion-resistant ceramics
- Refractory composites
5. Surface Treatment
- Sandblasting media: Cleaning, descaling, roughening
- Shot peening: Strengthening metal surfaces
6. Semiconductor & Electronics
- SiC ceramic substrates & components
- High thermal conductivity materials for heat dissipation
- Electronic packaging and sealing materials
7. Advanced Composites
- Ceramic matrix composites (CMC)
- High-wear industrial parts