Green Silicon Carbide (GC) Lapping Powder
1. Basic Introduction
Green silicon carbide lapping powder is high-purity alpha silicon carbide fine powder, featured with bright green color, ultra-high hardness, excellent self-sharpening property, chemical stability and tightly controlled particle size. It is widely used for precision lapping, fine grinding and mirror polishing of hard & brittle materials, especially for electronics, semiconductor and electronic ceramic industries.
| TYPICAL CHEMICAL ANALYSIS | |
| SiC | ≥99.05% |
| SiO2 | ≤0.20% |
| F,Si | ≤0.03% |
| Fe2O3 | ≤0.10% |
| F.C | ≤0.04% |
| TYPICAL PHISICAL PROPERTIES | |
| Hardness: | Mohs：9.5 |
| Melting Point: | Sublimes at 2600 ℃ |
| Maximum service temperature: | 1900℃ |
| Specific Gravity: | 3.20-3.25g/cm3 |
| Bulk density(LPD): | 1.2-1.6 g/cm3 |
| Color: | Green |
| Particle shape: | Hexagonal |
| Available Size： | |
| Micropowder： JIS:240# 280# 320# 360# 400# 500# 600# 700# 800# 1000# 1200# 1500# 2000# 2500# 3000# 4000# 6000# 8000# 10000# FEPA： F230 F240 F320 F360 F400 F500 F600 F800 F1000 F1200 F1500 F2000 | |
2. Key Properties
- High Purity: SiC content ≥98.5%~99.0%, low free silicon, iron and harmful impurities, suitable for high-standard semiconductor and electronic ceramic applications.
- Ultra-high Hardness: Mohs hardness 9.2–9.5, only lower than diamond and CBN; strong cutting ability and long service life.
- Excellent Self-sharpening: The grains fracture gradually during lapping, continuously exposing new sharp cutting edges, no easy passivation.
- Good Thermal Conductivity: Fast heat dissipation during grinding, effectively avoid thermal damage and micro-scratches on workpieces.
- Chemical Inertness: Acid & alkali resistant, high temperature oxidation resistance; no contamination to precision parts.
- Controlled Particle Size: Narrow particle size distribution, fine micron grade can achieve ultra-smooth mirror surface with low roughness.
3. Main Applications
- Semiconductor & Electronic Materials ：Silicon wafer, sapphire substrate, quartz crystal, AlN / alumina ceramic substrate precision lapping and mirror polishing.
- Electronic Ceramics Industry
- Precision surface polishing of alumina ceramic substrates
- Deburring and fine finishing of ceramic packaging & insulating components
- Surface smoothing of MLCC green tape and piezoelectric ceramic parts
- Optics & Precision Glass：Optical lenses, prisms, optical fiber connectors, wearable glass surface high-precision polishing.
- Hard Alloy & Precision Molds：Lapping and finishing of carbide tools, nozzles, ceramic bearings and precision molds.
4. Common Specifications
- Particle size: FEPA F230–F2000; JIS #800–#10000
- Electronic grade D50: 1~5 μm
- Appearance: pure green powder, good fluidity, low agglomeration
5. Comparison with White Fused Alumina Lapping Powder
- Hardness: Green SiC > White Alumina, higher grinding efficiency
- Toughness: White alumina higher; Green SiC more brittle with better self-sharpening
- Surface Finish: Green SiC delivers lower roughness & better mirror effect for precision electronic ceramics
- Application: White alumina for heavy-duty rough grinding; Green SiC for fine lapping & mirror polishing