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Green silicon carbide used in semiconductor industry

Green Silicon Carbide (SiC) abrasive is a high-purity material with exceptional hardness and sharpness, engineered to excel in applications requiring precision grinding, smooth finishing, and high thermal stability. Recognized for its bright green color, Green Silicon Carbide is highly effective on hard, brittle materials, such as glass, ceramics, and various non-ferrous metals, where fine finishes and efficient cutting capabilities are essential.

TYPICAL CHEMICAL ANALYSIS
SiC≥99.05%
SiO2≤0.20%
F,Si≤0.03%
Fe2O3≤0.10%
F.C≤0.04%
TYPICAL PHISICAL PROPERTIES
Hardness:Mohs:9.5
Melting Point:Sublimes at 2600 ℃
Maximum service temperature:1900℃
Specific Gravity:3.20-3.25g/cm3
Bulk density(LPD):1.2-1.6 g/cm3
Color:Green
Particle shape:Hexagonal

Applications

Precision Tool Production: Ideal for bonded and coated abrasives, such as grinding wheels, belts, and sandpaper, where precision is critical.

High-Gloss Polishing: Applied for polishing hard, brittle materials, creating smooth surfaces on ceramics, glass, and non-ferrous metals.

Cutting & Slicing: Suitable for creating thin cuts on brittle materials, making it effective for the semiconductor industry.

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